Samsung has reportedly ordered a significant amount of 2.5D packaging equipment, indicating that the Korean giant may or has seen huge demand from industry giants like Nvidia. Samsung recently jumped on the AI bandwagon by announcing its SAINT technology, which will rival TSMC’s CoWoS packaging solution. In this way, Samsung is expected to present its packaging and HBM capabilities to the industry and attract attention in the industry.Samsung is ready for Nvidia’s demands
We know that Nvidia is currently unable to keep up with the intense demand from artificial intelligence markets and plans to diversify its supply chains, which play a vital role in its prospects in the data center segment. Samsung is one of the leading companies in this supply chain. According to reports, it is stated that Samsung purchased 16 units of packaging equipment from the Japanese company Shinkawa, but more units may be added to this order depending on demand.
Nvidia’s goal of generating $300 billion in revenue from its AI segment by 2027 requires a consistent supply chain, which is why the company is allocating its supply of HBM3 and 2.5D packaging to Samsung for production of next-generation AI GPUs like the 2024 Blackwell, like TSMC, and more. It is said to be planning to reduce the workload on existing vendors.
This is truly great news for Samsung, as the company has been eager to jump on the AI bandwagon, and by striking a deal with Nvidia, not only has it seen an economic boost in the memory and AVP (Advanced Package) departments, but the Korean giant is already buying from companies like AMD and Tesla. managed to get an order. This showed that he could really emerge as an important player in the future.
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