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Samsung announced the world’s first LPCAMM memory: 128GB capacity in 60 percent less space!

Samsung today announced the development of the LPCAMM series, which uses LPDDR5X memory in a smaller, faster and more efficient package than standard memory. Samsung says its new LPDDR5X-6400 modules deliver up to 7.5 gigabits per second, and existing SO-DIMM...
 Samsung announced the world’s first LPCAMM memory: 128GB capacity in 60 percent less space!
READING NOW Samsung announced the world’s first LPCAMM memory: 128GB capacity in 60 percent less space!
Samsung today announced the development of the LPCAMM series, which uses LPDDR5X memory in a smaller, faster and more efficient package than standard memory. Samsung says the new LPDDR5X-6400 modules deliver up to 7.5 gigabits per second and use 60 percent less space while offering 50 percent more performance than existing SO-DIMM memory modules.

LPCAMM revolution in laptops

Samsung’s LPCAMM (Low Power Compression Attached Memory Module) memories will be released in 2024 in dual channel versions of 32, 64 and 128GB. Samsung has confirmed LPCAMM’s compatibility with Intel’s systems, but has yet to announce collaborations with other industry players such as AMD, Qualcomm or Apple. However, the company stated that it will test ‘next generation’ systems with other unspecified large customers this year, and that these modules could also potentially be used for data centres.

The GIF above reveals the most important advantage of the LPCAMM form factor. These modules reduce the memory DIMM footprint by up to 60 percent, paving the way for smaller, thinner and lighter designs. Other benefits include a whopping 50 percent performance boost and a 70 percent improvement in power efficiency, Samsung claims. We should point out that these numbers are quite ambitious.

Samsung will only use the CAMM standard for DDR5 for now – we won’t see DDR4 versions – but if the standard holds up we can expect to see DDR6 modules in the future. Samsung’s LPCAMM modules will also be detachable. Meanwhile, there will also be CAMM modules soldered directly to the motherboard.

Where did this CAMM come from?

The new RAM module technology called CAMM (Compression Attached Memory Module), introduced by Dell, is 57 percent thinner than traditional SODIMM designs and can accommodate up to 128GB capacity at this thinness. In the CAMM module, multiple memory membranes are collected on a single circuit board and the module is located on a single face. Each circuit board is connected to the motherboard via a CAMM compression connection. Again, each module has its own programmable memory circuit board. CAMM modules can also include SODIMM connections if standard connections are needed.

As you can see in the image above, larger CAMM modules are also possible. So it is also important that the standard is scalable. This memory standard developed by Dell was donated to the JEDEC memory standard committee. The first company to introduce CAMM-based products was Samsung.

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