The two companies joined forces to produce SoCs with high performance and low power. MediaTek and TSMC broke new ground together. Together, the two companies successfully developed the first 3nm mobile chipset that offers high power efficiency. This event was also the turning point of the MediaTek and TSMC partnership. In this way, MediaTek’s flagship Dimensity system-on-chip is left behind.
Power and performance leader 3nm chipsets will enter mass production in 2024!
TSMC’s 3nm process technology comes with high-performance computing support. It also provides full platform support for mobile applications. In addition, it will provide improved performance, power and efficiency.
When comparing Taiwanese manufacturer TSMC’s N5 node, the results are quite exciting. It offers an 18 percent power increase at the same power level. It is also a testament to the 60 percent increase in logic density and 32 percent power efficiency performance at the same speed.
MediaTek designed Dimensity SoCs to meet ever-increasing user experience requirements. Mobile computing, high-speed connection and artificial intelligence are among the biggest needs of the technology age. The 3nm chipset produced by the two companies joining forces will surpass Dimensity SoCs with its performance.
MediaTek and TSMC’s 3nm first flagship chipset will enter mass production in 2024. Additionally, starting from the second half of 2024, it will now power a variety of devices, from smartphones to smart cars.
MediaTek President Joe Chen: “We are committed to our vision of using the world’s most advanced technology to create cutting-edge products that meaningfully improve our lives. TSMC’s high-quality manufacturing capabilities will allow MediaTek to fully showcase its superior design in flagship chipsets. “It will also enable us to deliver the highest performance and quality solutions to our global customers and enhance the user experience in the flagship market.” said.
TSMC Senior Vice President of European and Asian Sales Dr. Cliff Hou: “This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of the industry’s most advanced semiconductor process technology is as accessible as the smartphone in your pocket. “Over the years, we have worked closely with MediaTek to bring many important innovations to market, and we are honored to continue our partnership through the 3nm generation and beyond.” said.
Apple announced A17 Bionic, its 3nm SoC exclusive to the iPhone 15 Pro and iPhone 15 Pro Max. Then, less than a week later, the MediaTek and TSMC duo released the latest technology product. It looks like this will heat up the market a lot.
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